| 項次 | 料號 | 數量 | 單位 | 需用日 | 小計 |
| | 品名規格 | | | 單價 | |
| 規格 | |
| 10 |
|
1 |
LOT |
20270108 |
|
| | 8x8 mm2 CLCC陶瓷封裝基板 | | |
________________ |
________________ |
| | 1. 基板設計型式：設計圖請參考附件；圖面編號：KD-VC1C88；數量：5,000 PCS
2. 基板材料：陶瓷，Total Area Size: 8.00 mm square,
3. Die attache Area: 5.9 mm2, Bottom Layer Thickness: 0.3 +/- 0.05mm
4. Wire bond layer: Pin Number 32 Pins, Thickness: 0.4 +/- 0.05mm
5. Seal Ring Layer: Thickness: 0.4 +/- 0.05mm
Material:
Die Attached Metal: Au./Ni./W, Thickness:> 13 um.
Backside Metal layer: Au./Ni./W, Thickness:>13 um.
Backside Metal Insulator: Alumina coating, Thickness:10 um normal
Sealing Ring Metal layer: Au./Ni./W, Thickness:>13 um.
|
| 20 |
|
1 |
LOT |
20270226 |
|
| | 8x8 mm2 CLCC陶瓷封裝基板 | | |
________________ |
________________ |
| | 1. 基板設計型式：設計圖請參考附件；圖面編號：KD-VC4573；數量：5,000 PCS
2. 基板材料：陶瓷，Total Area Size: 8.00 mm square,
3. Die attache Area: 5.9 mm2, Bottom Layer Thickness: 0.3 +/- 0.05mm
4. Wire bond layer: Pin Number 32 Pins, Thickness: 0.4 +/- 0.05mm
5. Seal Ring Layer: Thickness: 0.4 +/- 0.05mm
Material:
Die Attached Metal: Au./Ni./W, Thickness:> 13 um.
Backside Metal layer: Au./Ni./W, Thickness:>13 um.
Backside Metal Insulator: Alumina coating, Thickness:10 um normal
Sealing Ring Metal layer: Au./Ni./W, Thickness:>13 um.
|
|